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IRVINE, Calif., Apr 12, 2004 /PRNewswire-FirstCall via COMTEX/ -- Broadcom Corporation (Nasdaq: BRCM), a leading provider of semiconductor solutions enabling broadband communications, today announced that its BCM4317 AirForce One™ wireless LAN solution was selected as a winner of the 2003 EDN Innovation Awards. This prestigious awards program honors outstanding electronic products, technologies and inventors, as chosen by EDN Magazine editors and readers. Broadcom's AirForce One™ solution, the world's first single-chip wireless LAN transceiver, was selected from a field of hundreds of products and named the year's most innovative networking and communications chip.
The Broadcom® AirForce One chip is the industry's smallest and most efficient wireless LAN solution, enabling integrated Wi-Fi® functionality in a greater range of small devices than previously possible. The single chip solution integrates a 2.4 GHz radio, power amplifier, 802.11b baseband processor, medium access controller (MAC), and all other radio components onto a single silicon die -- enabling an AirForce One™ reference design module that is 87 percent smaller than traditional Wi-Fi solutions. The innovative solution also offers a unique power management scheme that consumes less power than other Wi-Fi solutions to extend the battery life of Wi-Fi enabled devices. In addition to the benefits of a single-chip design, the AirForce One solution leverages Broadcom's CMOS hardware expertise and proven OneDriver™ software to deliver the superior performance, range and security features of its industry-leading wireless LAN chipsets.
"Broadcom is very proud to have the hard work and creativity of our engineers recognized by one of the most respected information sources in the electronics industry," said Dr. Edward Frank, Vice President of Research and Development of Broadcom. "The EDN Innovation Award is further validation of our RF, signal processing, SoC and software technology leadership and execution, which has continued to drive the industry and redefine the communications marketplace."
"Despite a tough economy in 2003, it is clear that the innovative spirit is still flourishing in the electronics industry," said Maury Wright, editor-in-chief of EDN Magazine. "The recipients of the EDN Innovation Award represent the best-of-the-best in developing the products and technologies that handle the interface to the analog world, that carry the computational burden for multimedia and communications, and that implement test, development, and design for semiconductors and systems via software."
Wright added, "The 14th Annual EDN Innovation Awards is proud to recognize innovations across the entire gamut of technologies that are key to creating products that everyone can enjoy and use. We applaud the engineering profession for creating advancements that put technology to work for people in their everyday lives."
Broadcom's Wireless LAN Product Family
Broadcom's high performance wireless LAN product line includes 54g™, the world's most popular 54 Mbps Wi-Fi technology. In addition to transceivers that provide IEEE 802.11b, 802.11g and dual-band 802.11a/g solutions, Broadcom integrates wireless network processors, communications technologies and OneDriver software solutions into reference designs that speed customer time to market. Broadcom partners are developing Wi-Fi client solutions, access points, routers, cable modems, DSL modems, Bluetooth® solutions and GPRS cellular products.
All of the wireless chipsets in the Broadcom product line enjoy unique performance advantages that improve throughput and range via Broadcom's SmartRadio™ technology. In addition to advanced signal processing techniques, the all-CMOS solutions are capable of self-calibrating based on usage temperature and other environmental conditions, reconfiguring constantly for optimum performance. Competing radios are statically calibrated at the point of manufacture and are unable to adapt to changing environmental influences.
About Broadcom
Broadcom Corporation is a leading provider of highly integrated semiconductor solutions that enable broadband communications and networking of voice, video and data services. We design, develop and supply complete system-on-a-chip (SoC) solutions incorporating digital, analog and radio frequency (RF) technologies, as well as related hardware and software system-level applications. Our diverse product portfolio addresses every major broadband communications market and includes solutions for digital cable and satellite set-top boxes; high definition television (HDTV); cable and DSL modems and residential gateways; high-speed transmission and switching for local, metropolitan, wide area and storage networking; home and wireless networking; cellular and terrestrial wireless communications; Voice over Internet Protocol (VoIP) gateway and telephony systems; broadband network and security processors; and SystemI/O™ server solutions. These technologies and products support our core mission: Connecting everything®.
Broadcom is headquartered in Irvine, Calif., and may be contacted at 1-949-450-8700 or at www.broadcom.com.
About EDN
EDN, the premier design magazine of the electronics industry, is published by Reed Business Information. Headquartered in Newton, Massachusetts, EDN serves the vital information needs of design engineers and engineering managers worldwide. The EDN franchise includes EDN, EDN Europe, EDN Asia, EDN Australia, EDN China, EDN Japan, and EDN.com, the only full-content, EOEM publication and Web site. EDN is a publication within Reed Electronics Group, part of Reed Elsevier plc group (NYSE: RUK, ENL) -- a world-leading publisher, trade show producer and information provider operating in the science and medical, legal, education and business-to-business industry sectors.
Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:
All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.
Important factors that may cause such a difference for Broadcom in connection with its wireless LAN products and reference designs, such as its AirForce One chip include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for high-speed wireless networking applications; delays in the adoption and acceptance of industry standards in those markets; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; our ability to scale our operations in response to increases in demand for our products and services; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; our ability to retain and hire key executives, technical personnel and other employees in the numbers, with the capabilities, and at the compensation levels needed to implement our business and product plans; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the loss of a key customer; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a timely manner; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; the volume of our product sales and pricing concessions on volume sales; the effects of new and emerging technologies; changes in our product or customer mix; intellectual property disputes and customer indemnification claims and other types of litigation risk; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.
Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason.
Broadcom®, the pulse logo, Connecting everything®, 54g™, AirForce One™, OneDriver™, SmartRadio™ and SystemI/O™ are trademarks of Broadcom Corporation and/or its affiliates in the United States and certain other countries. Wi-Fi® is a, trademark of the Wi-Fi Alliance. Bluetooth® is a trademark of the Bluetooth SIG.. All other trademarks mentioned are the property of their respective owners.
Broadcom Trade Press Contact
Henry Rael
Sr. Communications Specialist
949-585-5734
hrael@broadcom.com
Broadcom Business Press Contact
Bill Blanning
Sr. Director, Corporate Communications
949-585-5555
blanning@broadcom.com
Broadcom Technical Contact
Jeff Abramowitz
Sr. Director, Marketing
408-543-3311
jeffa@broadcom.com
Broadcom Investor Relations Contact
T. Peter Andrew
Sr. Director, Investor Relations
949-926-5663
andrewtp@broadcom.com
SOURCE Broadcom Corporation
Broadcom Trade Press, Henry Rael, Sr. Communications Specialist, +1-949-585-5734, hrael@broadcom.com, or Broadcom Business Press, Bill Blanning, Sr. Director, Corporate Communications, +1-949-585-5555, blanning@broadcom.com, or Broadcom Technical, Jeff Abramowitz, Sr. Director, Marketing, +1-408-543-3311, jeffa@broadcom.com, or Broadcom Investor Relations, T. Peter Andrew, Sr. Director, Investor Relations, +1-949-926-5663, andrewtp@broadcom.com, all of Broadcom Corporation
http://www.broadcom.com
