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DOCSIS 2.0-Certified Cable Modems Using Broadcom's Second Generation Chip Available in Production Volumes Mid-Q2 2004
IRVINE, Calif., April 27 /PRNewswire-FirstCall/ -- Broadcom Corporation, (Nasdaq: BRCM), a leading provider of highly integrated semiconductor solutions enabling broadband communications, today continued its leadership position in advancing cable modem technology with the introduction of its next generation single-chip cable modem solution, the Broadcom® BCM3349. In production this month, the BCM3349 is an advanced DOCSIS 2.0-based cable modem chip that addresses the increased performance and reliability demands of high-speed data, voice and gateway modem designs.
Broadcom has received production orders from customers for the BCM3349 as well as the BCM3419 silicon tuner to go into DOCSIS 2.0-certified cable modems. Production volumes of these new cable modem products will be available this quarter.
The enhanced features of the BCM3349 offer cable modem vendors both improved performance and reliability, as well as significant component count reduction over other solutions. Cable modems using the BCM3349 will operate 25 percent faster than modems using previous solutions, due to a new integrated processor performing at 250 MIPS, and will support individual modem throughput at the full-channel capacity of the DOCSIS 2.0 specification. Using Broadcom's advanced integration technologies, the BCM3349 enables vendors to reduce the component count of their data modem solutions by more than 20 percent from previous industry leading designs.
"The BCM3349 and BCM3419 allow our customers to create extremely cost effective solutions that will enable them to successfully compete in the highly competitive DOCSIS cable modem market," said Jay Kirchoff, Broadcom's Director of Marketing for Cable Modems.
"The BCM3349 represents our second generation of DOCSIS 2.0-based cable modem chips. Thanks to the outstanding execution of Broadcom's engineering teams, we have shipped over 60 million DOCSIS-based chips for data, voice, and gateway cable modem and set-top box applications to date," Kirchoff said.
The DOCSIS 2.0 specification enables the tripling of upstream data capacity, from the consumer to the cable operator, creating a cable network that operates at up to 40 Megabits per second (Mbps) downstream and 30 Mbps upstream. This tripling of upstream speed enables cable modem service providers to expand their broadband service offerings to both businesses and consumers to include higher speed and symmetric data service tiers, multi-line cable telephony, video conferencing, streaming IP video, and remote learning applications.
The BCM3349 is sampling today and is available in several reference designs for data, voice and gateway cable modem applications. The chip is packaged in a 316-pin PBGA and is priced at $20.00 each in quantities of 10,000.
About Broadcom
Broadcom Corporation is a leading provider of highly integrated semiconductor solutions that enable broadband communications and networking of voice, video and data services. We design, develop and supply complete system-on-a-chip (SoC) solutions incorporating digital, analog and radio frequency (RF) technologies, as well as related hardware and software system-level applications. Our diverse product portfolio addresses every major broadband communications market and includes solutions for digital cable and satellite set-top boxes; high definition television (HDTV); cable and DSL modems and residential gateways; high-speed transmission and switching for local, metropolitan, wide area and storage networking; home and wireless networking; cellular and terrestrial wireless communications; Voice over Internet Protocol (VoIP) gateway and telephony systems; broadband network and security processors; and SystemI/O™ server solutions. These technologies and products support our core mission: Connecting everything®.
Broadcom is headquartered in Irvine, Calif., and may be contacted at 1-949-450-8700 or at www.broadcom.com.
Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:
All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.
Important factors that may cause such a difference for Broadcom in connection with the BCM3349 and BCM3419 product families include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for cable applications; delays in the adoption and acceptance of industry standards in those markets; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; our ability to scale our operations in response to increases in demand for our products and services; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; fluctuations in the manufacturing yields or our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; our ability to retain and hire key executives, technical personnel and other employees in the numbers, with the capabilities, and at the compensation levels needed to implement our business and product plans; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the loss of a key customer; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a timely manner; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; the volume of our product sales and pricing concessions on volume sales; the effects of new and emerging technologies; changes in our product or customer mix; intellectual property disputes and customer indemnification claims and other types of litigation risk; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.
Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason.
Broadcom®, the pulse logo, Connecting everything®, and SystemI/O™ are trademarks of Broadcom Corporation and/or its affiliates in the United States and certain other countries. CableLabs® and DOCSIS® are trademarks of Cable Television Laboratories, Inc. Any other trademarks or trade names mentioned are the property of their respective owners.
Broadcom Trade Press Contact
Laura Brandlin
Director of Marketing Communications
949-926-5108
lbrandlin@broadcom.com
Broadcom Business Press Contact
Bill Blanning
Sr. Director, Corporate Communications
949-926-5555
blanning@broadcom.com
Broadcom Technical Contact
Jay Kirchoff
Director of Marketing, Cable Modems
678-475-3187
kirchoff@broadcom.com
Broadcom Investor Relations Contact
T. Peter Andrew
Sr. Director, Investor Relations
949-926-5663
andrewtp@broadcom.com
SOURCE Broadcom Corporation
-0- 04/27/2004
/CONTACT: trade press, Laura Brandlin, Director of Marketing
Communications, +1-949-926-5108, lbrandlin@broadcom.com, or business press,
Bill Blanning, Sr. Director, Corporate Communications, +1-949-926-5555,
blanning@broadcom.com, or technical, Jay Kirchoff, Director of Marketing,
Cable Modems, +1-678-475-3187, kirchoff@broadcom.com, or investor relations,
T. Peter Andrew, Sr. Director, Investor Relations, +1-949-926-5663,
andrewtp@broadcom.com, all of Broadcom Corporation/
/Web site: http://www.broadcom.com /
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